
Full-Text - AbstractShort samples (20 cm) are analysed with ultrasonic C-scan imaging applying the pulse-echo immersion technique. Focused ultrasonic probes with nominal frequencies up to 50 MHz are used in conjunction with a high-precision mechanical scanner.
For quality assurance reasons it is necessary to monitor the bond-quality continuously along the whole cable length (up to 80 km). Mechanical (x-y) scanning of the complete bond-area, however, takes up too much time. As a first step we performed a partial bond-test with two fixed 10 MHz point-focused probes. The echo amplitude of 1 mm bond-width was recorded in function of position. In this way we have continuously tested 5 km Fermilab DO cable on both sides. To control the quality of the whole bond-width over the total length we propose the phased array technique. The sound beam is scanned electronically perpendicular to the direction of production. That is why such a testing is sufficiently fast in order to allow a continuous analysis. A new 10 MHz linear array probe with 128 elements was designed and manufactured. With the new probe in conjunction with the appropriate electronics and software a large number of test samples were investigated.
In conclusion, we have demonstrated the power of ultrasonic imaging in the bond quality control of high-current superconducting cables. We are convinced that the continuous testing will be feasible with the phased array technique.
![]() Fig. 10 MHz phased array C-scan of a Fermilab DO sample: disbonded areas are dark-grey (left and right) |
Abstract Source:
Book of Abstracts, 7th European Conference on Non-Destructive Testing, 26-29 May 1998, ISBN: 87-986898-0-00
Full-Text Source:
Proceedings of the 7th European Conference on Non-Destructive Testing, 26-29 May 1998, ISBN:
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