
Full-Text - AbstractTesting is done using four separate successive testing systems in the assembly line. First a laminar-type flaw testing is effected at the endless plate via pulse-echo immersion technique. Immediately after bending and bonding, a flaw testing of the weld zone is carried out at the endless tube via contact technique. At the same time a special arrangement of oscillating ,,squirters" detects the contour of the weld zone via pulse-echo testing. The result is shown diagrammatically. After cutting, a laminar-type flaw testing of the tube ends is carried out in the third testing station using pulse-echo immersion technique. At least a flaw detection of the weld zone in contact testing will be done at the inactive tube using a moving test carriage system.
The four electronic ultrasonic inspection systems consist of the same components from the SIMUS ultrasonic system. These components can be configured in such a way that they fit in various test requirements. Modular ultrasonic-specific hardware components using VMEBus as well as UNIX software modules which are used to build the modular systemdependent surfaces belong to such components.
The flaw detection of the weld zone is done using commercial 45° angle probes at 4 MHz. The detection of the weld zone contour is effected by a commercial high resolving probe of 20 MHz. For laminar-type flaw testing of plates and of tube ends Siemens developed special high resolving probes of 10 MHz, each having an active transducer area of 3 mm x 25 mm.
It is possible to fulfill different test requirements using the SIMUS ultrasonic testing system due to the configuration of the following functions, which are able to vary computer-controled from single shot to shot.
Moreover- all important device functions and ultrasonic functions are monitored via an extensive self control algorithmus.
Abstract Source:
Book of Abstracts, 7th European Conference on Non-Destructive Testing, 26-29 May 1998, ISBN: 87-986898-0-00
Full-Text Source:
Proceedings of the 7th European Conference on Non-Destructive Testing, 26-29 May 1998, ISBN:
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