Abstract:
A single transducer ultrasonic imaging method, that eliminates the effect of thickness variation in the image, and its application to ceramic materials, are described. The method, commercialized under a cooperative agreement between NASA Lewis Research Center and Sonix, Inc., isolates ultrasonic variations due to material microstructure. Its use can result in significant cost savings because the ultrasonic image can be interpreted correctly without the need for precision thickness machining during nondestructive evaluation sieges of material development. The method is shown to provide more accurate and quantitative materials characterization as compared to that for conventional ultrasonic c-scan.
(Ref. SXVIII-017-97)
Source: NDE of Ceramics '97 May 4-7, Symposium on Nondestructive Evaluation of Ceramics
at the American Ceramic Society 99th Annual Meeting, Cincinnati, Ohio.
Buying the Symposium Proceedings from the American Ceramic Society.
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