Title: ULTRASONIC CHARACTERIZATION OF MICROWAVE JOINED SILICON CARBIDE-/SILICON CARBIDE

Abstract:
High frequency (50-150 MHz), ultrasonic immersion testing has been used to characterize the surface and interfacial joint conditions of microwave bonded, monolithic silicon carbide (SiC) materials. The high resolution ultrasonic C-scan images point to damage accumulation after thermal cycling. Image processing was used to study the effects of the thermal cycling on waveform shape, amplitude and distribution. Such information is useful for concurrently engineering material fabrication processes and suitable nondestructive test procedures.
(Ref. SXVIII-044-97)

Source: NDE of Ceramics '97 May 4-7, Symposium on Nondestructive Evaluation of Ceramics at the American Ceramic Society 99th Annual Meeting, Cincinnati, Ohio.
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