| ABSTRACT: | ADHESIVE CURE MONITORING WITH ACOUSTIC METHOD
E.Yu.Maeva, and I.A. Severina
Industrial Research Chair in Applied Solid State Physics and Material Characterization, University of
Windsor, Windsor, Ontario, Canada
Conditions of the adhesive cure process play a very important role in providing the quality of adhesive
joints. It is known that the cure stage of the adhesives has some correlation with glass transition temperature
value and strength of adhesion. The objective of the present work is to quantitatively characterize the curing
process of termoset adhesives with the acoustic method. An ultrasonic pulse was emitted into the designed
curing cell with the adhesive inside, and the acoustic response was detected. The variations in sound
velocity; attenuation and elastic module during the cure time were simultaneously monitored. Acoustic
parameters changes are discussed with respect to phases of adhesive curing process. Dependence of cure
dynamics and acoustic parameters on the cure temperature was shown. Dependence of ratio prepolymer to
the curing agent on acoustic parameters and the dynamics of the cure was also investigated. The correlation
of the cure degree determined by acoustic and other methods is discussed. The microstructure of the
adhesives cured in different conditions was investigated with acoustic microscopy and its correlation with
other detected parameters was studied. The provided technique can be useful in industrial applications for
non-destructive testing of the adhesive cure conditions.
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