Thermographical Detection of Defects of Lumber and Glued Joints
Minoru MASUDA, Shingo TAKAHASHI Graduate School of Agriculture, Kyoto Univ., JAPAN
ABSTRACT
Temperature changes of glued joints of laminated lumber and finger joints were observed using infrared thermographical technique. Rise of temperature was observed at the points of delamination of the glued joints in cyclic bending and/or cyclic compression of low load. This method can be used for the non-destructive detection of defects of glue joints.
Publication Source: Proceedings of the 12th International Symposium on Nondestructive Testing of Wood University of Western Hungary, Sopron, 13-15 September 2000, ISBN 963 7180 88 5 Publisher: University of Western Hungary, H 9400 Sopron, P.O.Box 132, FAX: +36 99 311 103
