Ultrasonic guided waves in adhesive layers are strongly affected by bond quality. Accordingly, this method for bond strength measurement, utilizing guided ultrasonic waves, is introduced. The analysis indicated that measurement of the propagation velocity may provide information about the strength of the bond. The advantage of this technique is that it interacts directly with the adhesive layer. The results indicate that there is a good correlation between the velocity of the guided wave and the bond strength and therefore can be used to classify the interface imperfection. Several bonds were studied and the results are promising. Although guided waves are more difficult to generate and detect than conventional ultrasonic bulk waves, they do provide more information about the state of the bond and provide a useful nondestructive evaluation tool.
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