code | ABSTRACT
includes links to Full-Text and Options | INSPECTION OF MICRO-SYSTEMS | FULL-TEXT
and Options |
|
201 |
BARE PCB INSPECTION BY MEAN OF ECT TECHNIQUE WITH SPIN-VALVE SENSOR | Komkrit Chomsuwan, Kanazawa University, Japan | 487
 |
493 |
ELASTICITY CHARACTERIZATION OF PIEZOELECTRIC DOMAIN BOUNDARY BY ULTRASONIC ATOMIC FORCE MICROSCOPY | Toshihiro Tsuji, National Institute Of Advanced Industrial Science And Technology, Japan | 708
|
568 |
3D RECONSTRUCTION OF MICRO-SYSTEMS USING X-RAY TOMOGRAPHIC METHODS | Sven Gondrom, Fraunhofer Institute, Germany | 672
|
655 |
NANOSCOPIC EVALUATION OF MICRO-SYSTEMS | Ludwig Josef Balk, University of Wuppertal, Germany | 1187
|
732 |
QUANTITATIVE MEASUREMENT OF ELASTIC CONSTANTS OF ANISOTROPIC MATERIALS BY ATOMIC FORCE ACOUSTIC MICROSCOPY | Walter Arnold, Fraunhofer-institute For Non-destructive Testing, Germany | 265
|
783 |
IMAGING OF MICRO- AND NANOSTRUCTURES WITH X-RAY TECHNIQUES: APPLICATIONS IN MICROELECTRONICS AND IN MICRO-SYSTEM TECHNOLOGY | Tilo Baumbach, Fraunhofer Institute for Nondestructive Testing, Germany | 623
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