Re: Problem: detection of defects at soldered joint

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Re: Problem: detection of defects at soldered joint
Posted by: Rod Martin (PID_370), E-mail: ndt@ndt.com.au, on March 24, 2000 at 03:49 :
In Reply to: Problem: detection of defects at soldered joint posted by : Peter Bergmann on March 23, 2000 at 14:58:
: Dear NDT experts,
: could anybody give me information concerning the following NDT problem:
: I have to detect defects in soldered, non ferromagnetic components with curved surfaces. The 0.1mm - defects (pore spaces) at the soldered joints are located in a depth of up to 5mm below the accessible surface.
: A NDE method is required which is suitable for the integration in a manufacturing process. The concerning components vary very much in their shapes. So no scanning ultrasound or scanning eddy current method seems to be suitable.
: Thank you very much
: Thomas
Dear Ingolf,
Would suggest you consider Thermal Wave Imaging for you application. TWI is a method of injecting a low amount of heat into an object and grabbing the various frames throughout the cooling period. This is a quick methodology and can be applied to a manufacturing process. Should you care to send a sample with known defects, please contact me direct on the above email address.
Yours faithfully

Rod Martin

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: : Dear NDT experts, : : could anybody give me information concerning the following NDT problem: : : I have to detect defects in soldered, non ferromagnetic components with curved surfaces. The 0.1mm - defects (pore spaces) at the soldered joints are located in a depth of up to 5mm below the accessible surface. : : A NDE method is required which is suitable for the integration in a manufacturing process. The concerning components vary very much in their shapes. So no scanning ultrasound or scanning eddy current method seems to be suitable. : : Thank you very much : : Thomas : Dear Ingolf, : Would suggest you consider Thermal Wave Imaging for you application. TWI is a method of injecting a low amount of heat into an object and grabbing the various frames throughout the cooling period. This is a quick methodology and can be applied to a manufacturing process. Should you care to send a sample with known defects, please contact me direct on the above email address. : Yours faithfully : : Rod Martin

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