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Re: Problem: detection of defects at soldered joint

Posted by: andy cunningham Profile (PID_533), E-mail: andyshome8@hotmail.com, on March 24, 2000 at 23:46 :

In Reply to: Problem: detection of defects at soldered joint posted by : Peter Bergmann on March 23, 2000 at 14:58:

: Dear NDT experts,

: could anybody give me information concerning the following NDT problem:
: I have to detect defects in soldered, non ferromagnetic components with curved surfaces. The 0.1mm - defects (pore spaces) at the soldered joints are located in a depth of up to 5mm below the accessible surface.
: A NDE method is required which is suitable for the integration in a manufacturing process. The concerning components vary very much in their shapes. So no scanning ultrasound or scanning eddy current method seems to be suitable.

: Thank you very much

: Thomas

have you tryed x ray using 2 or 3 films in one cassette and view them laminated as one film. (theory is more silver, the more sensitive.
we had great success when u/t faild in inspecting aluminum bonded cooling fins.
there are more complex ut methods that was used on the JET's project in the UK, but that 50mm x75mm thick copper solderd joints. ut was my only option due to thickness. if it is possible could you be more specific
ithe more information the more help!



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