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Nondestructive evaluation of disbonding area in chip scale packages using resonance ultrasound spectroscopy

Masahiko Hirao, Keiji Sato, Hirotsugu Ogi
Graduate School of Engineering Science, Osaka University, Machikaneyama 1-3, Toyonaka,
Osaka 560-8531, Japan
Takekazu Miya
Sonix K.K., Hyakunin-cho 2-6-7, Sinjuku-ku, Tokyo 169-0073, Japan.
Contact

Introduction

Sample CSP

Resonant ultrasound spectroscopy measurements

Result and discussion

Acknowledgments

References

  1. R.Ghaffarian, Trans.ASME, J.Elect.Packaging, Vol.122, p.335, 2000.
  2. J.Maynard, Phys.Today, Vol.49, p.26, 1996.
  3. A.Migliori and J.Sarao, Resonance Ultrasound Spectroscopy, Wiley,New York,1997.

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