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Characterization of Imperfect Interfaces in IC Packaging using Deconvolved Ultrasonic Signals

X. Jian, N. Guo, J.Abdul, and H.C. Yeo
School of Mechanical & Production Engineering
Nanyang Technological University
Singapore 639798


1. Introduction

2. Multilayer spring model

3. Simulated ultrasonic response of IC packaging

Fig 2: Echo analysis from structure si/adh/cu.


Discussion and conclusions



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