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NDE of Moisture in Encapsulant resin of IC Packages by Microwaves

Y. Ju, S. Sanpei, M. Saka
Department of Mechanical Engineering,
Tohoku University, Sendai 980-8579, Japan
H. Abé
Tohoku University, Sendai 980-8577, Japan
Contact

ABSTRACT

INTRODUCTION

BASIC DEFINITION AND PRINCIPLE

EXPERIMENTAL PROCEDURE

RESULTS

CONCLUSIONS

ACKNOWLEDGEMENTS

REFERENCES

  1. H. Lee and Y. Y. Earmme, "A Fracture Mechanics Analysis of the Effects of Material Properties and Geometries of Components on Various Types of Package Cracks", IEEE Transactions on Components, Packaging, and Manufacturing Technology-Part A, Vol. 19, 1996, 168-178.
  2. S. Yi and G. H. Neo, "Hygrothermo-mechanical Behavior of Mold Compound Materials at Elevated Environment", Proc. Workshop on Mechanical Reliability of Polymeric Materials & Plastic Packages of IC Devices, ASME, Paris, EEP-Vol. 25, 1998, 271-275.
  3. Y. Ju, M. Saka and H. Abé, "A Method of the Measurement of Moisture in IC Packages Using Microwaves", Proc. the 1st International Workshop on Electronics Materials and Packaging, Singapore, 1999, 182-187.
  4. R. J. King, K. V. King and K. Woo, "Microwave Moisture Measurement of Grains", IEEE Transactions on Instrumentation and Measurement, Vol. 41, 1992, 111-115.
  5. Y. Ju, M. Saka and H. Abé, "Microwave Imaging for the Integrity Assessment of IC Package", Advances in Electronic Packaging 1999, ASME, Hawaii, EEP-Vol. 26-1, 1999, 847-853.

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