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Technical Discussions
Mahir Genc
Director,
Tesko NDT Company, Turkey, Joined Apr 2014, 6

Mahir Genc

Director,
Tesko NDT Company,
Turkey,
Joined Apr 2014
6
21:55 Jan-09-2015
About choice of PAUT and TOFD devices

Dear Colleagues,

At the pipelines of refineries, I want to work with PAUT and TOFD methods according to ASME and EN codes, besides of radiography.

Pipes are going to be carbon steel and stainless steel, mostly.
Pipes’ diameters are going to be between 3” and 48” and their thickness’ 3 mm and over.
What is the minimum acceptable thickness?
What is the advantages and disadvantages of this methods ?
What kind of training required and where can it be taken ?
Which devices is needed for the methods mentioned ?
How can i make the selection for the appropriate probes ?
Which one of the devices will be effective for application? (flaw detection, testing time, test evaluation time and the most importantly ofc cost.)

If you answer that questions and keep me informed, i will be glad.

Mahir

 
 Reply 
 
Joe Buckley
Consultant, ASNT L-III, Honorary Secretary of BINDT
Level X NDT, BINDT, United Kingdom, Joined Oct 1999, 528

Joe Buckley

Consultant, ASNT L-III, Honorary Secretary of BINDT
Level X NDT, BINDT,
United Kingdom,
Joined Oct 1999
528
22:48 Jan-10-2015
Re: About choice of PAUT and TOFD devices
In Reply to Mahir Genc at 21:55 Jan-09-2015 (Opening).

Mahir

This is a huge subject and I would recommend reading around it a lot, there are a lot of articles on ndt.net

Looking at your questions in detail


Pipes are going to be carbon steel and stainless steel, mostly.
-> Both techniques are applibale for both, although most peublished work on TOFD relaltes to carbon steel.

Pipes’ diameters are going to be between 3” and 48” and their thickness’ 3 mm and over.

-> scanners exist to cover this range

What is the minimum acceptable thickness?

->standard techniques and analysis work for materials from around 6-7mm up. It is possible to test thinner than this, but it needs experience and there are limits to how well you can quantify defects.

What is the advantages and disadvantages of this methods ?

-> Huge subject - read some papers. However PA and TOFD complement each other, its normally advantageous to use both

What kind of training required and where can it be taken ?

-> Normally experienced UT operators can take the level II TOFD and PA course, but experience and supervision are needed. Distributors normally carry out basic familiarization training, but I would recommend attending one of the approved training establlishmenst I don't think any training is available in Turkey (I have had some discussions on providing basic training in Istanbul) but I may be wrong

Which devices is needed for the methods mentioned ?

-> Medium range Phased array flaw detectors (veo, Omniscan, Focus-scan etc.) normally are capable of both techniques.

How can i make the selection for the appropriate probes ?

Thats a complex subject, but easy once you've covered the basic training, or spoken to a distributor.

Which one of the devices will be effective for application? (flaw detection, testing time, test evaluation time and the most importantly ofc cost.)

-> Talk to your distributor, but capabilities of the different brands are similar since they all use the same physics, and to cover the range of sizes you've discussed the scanners, probes etc will be a big part of the cost.

Good luck

Joe

1
 
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