where expertise comes together - since 1996 -

The Largest Open Access Portal of Nondestructive Testing (NDT)

Conference Proceedings, Articles, News, Exhibition, Forum, Network and more

where expertise comes together
- since 1996 -

Our Phased Array equipments, based on SITAU Technology, are among the PAS highest performance in the market.
Technical Discussions
09:36 Jun-23-2016
Detection of unbonds in honeycomb sandwich using MIA


I would like to clarify for the detection of unbonds in honeycomb sandwich using MIA

1. For the stiffness differences that the MIA method is detecting, is there any contribution to this stiffness difference from the composite face-sheet on the opposite side or is it mainly due to the honeycomb core that the face-sheet is bonded to?

I.e. we are comparing stiffness of near-side face-sheet only (for unbond) versus

Case 1: honeycomb core + near-side face-sheet only (good area)
Case 2: honeycomb core + near-side face-sheet + far-side face-sheet (good area)

Assume CFRP face-sheet of 2-3 plies so around 0.5mm thick and Nomex Honeycomb of about 5mm thick.

2. What is the effect of the probe diameter on the detection performance?

Thanks for the help!!

03:39 Jun-28-2016
Re: Detection of unbonds in honeycomb sandwich using MIA
In Reply to wei at 09:36 Jun-23-2016 (Opening).

Hi Wei,
May be there is a delamination between the sheet (monolithic) and the honeycomb.
I suggest you to use infrared thermography method (IRT) to check this.

10:59 Jun-28-2016
Re: Detection of unbonds in honeycomb sandwich using MIA
In Reply to Adel at 03:39 Jun-28-2016 .

Hi Adel,

Thanks for suggestion.

I am considering the use of Mechanical Impedance Analysis due to the geometry. It will be for inspection of radius. So not sure if thermography is suitable for that.


Product Spotlight


Very Powerful Superior Performance Extremely Portable Smart Phased Array Ultrasonic Flaw Detector an
d Recorder with 2 Conventional UT and TOFD Channels uniquely combines PA, single- and multi-channel conventional UT, and TOFD modalities providing 100% raw data recording and imaging. Suitable for all kinds of every-day ultrasonic inspections

GEKKO, Standard and Advanced phased-array for Easier inspection

M2M Gekko® is a field-proven flaw detector offering PAUT, UT, TOFD and TFM through the streamline
d user interface Capture™. Released in 32:128, 64:64 or 64:128 channel configurations, Gekko combines high- resolution and speed while reducing inspectors’ training time.

OmniScan™ X3 flaw detector

The OmniScan X3 flaw detector is a complete phased array toolbox. Powerful tools, like total focus
ing method (TFM) images and advanced visualization capabilities, enable you to complete your inspection with greater confidence.


Next generation for Phased Array UT is here now with FMC/TFM! Have higher resolution imaging, impr
oved signal to noise ratio, characterize, size and analyze defects better with access to several wave mode views and save raw FMC data for higher quality analysis.  Some of the benefits are:
  • Beautiful Image! Easier to understand what you're looking at
  • Completely focused in entire image or volume
  • Much easier to define setups before inspection
  • Easier to decipher geometry echoes from real defects
  • Oriented defects (e.g. cracks) are imaged better
  • See image from different wave modes from one FMC inspection
  • FMC data can be reprocessed/analyzed without going back to the field

We use technical and analytics cookies to ensure that we will give you the best experience of our website - More Info
this is debug window