- since 1996 -
Research and Application Development For NDT
Acuren’s Research and Application Development specializes in the development of advanced ultraso
nic inspection techniques and systems for challenging inspection applications, with an emphasis on practical solutions which are field deployable. Services include manual and automated ultrasonic inspection system development, inspection technique optimization using laboratory scale studies and ultrasonic modeling (CIVA, BeamTool), preparing technical justification for technique evaluation and qualification (Probability of Detection and sizing accuracy studies), inspection/calibration/analysis procedure preparation to support field deployment of custom techniques, and development of custom imaging algorithms to support challenging inspection applications.
Typical Phased Array probes have frequencies between 1MHz and 20MHz and the number of wafers is 10
to 128. M2 Electronics offers customers conventionally ultrasound probes and the ability to provide high-precision Phased Array Ultrasound Probes of up to 256 wafers. We can also customize the probe for our customers to meet the specific application requirements of the user.
Cygnus 6+ PRO Multi-Mode Ultrasonic Thickness Gauge
The Cygnus 6+ PRO thickness gauge is the most advance gauge within the Cygnus range with key featu
res including: comprehensive data logging; A-scan and B-scan display; manual gain control; Bluetooth connectivity; and much more. With its unique dual display and three measuring modes (Multiple-Echo, Echo-Echo and Single-Echo), this surface thickness gauge offers maximum versatility for inspections.
Compact NDT inspection-heads for measurements with active thermography
The compact inspection head is suitable for thermographic ndt tasks. The uncooled infrared camera
is specially developed for NDI-tasks and offers a thermal sensitivity until now known only from thermal imagers with cooled detector. All required components and functions are integrated into the inspection-head. You will only need an ethernet cable to connect the sensor with the evaluation system.