- since 1996 -
Combination of Digital Image Correlation and Thermographic Measurements
The combination of measuring results from the digital image correlation (ARAMIS, DIC) and temperat
ure measuring data from infrared cameras permits the simultaneous analysis of the thermal and mechanical behavior of test specimens in the materials and components testing field.
NEW - TD Focus-ScanRX
The NEW Next Generation Advanced UT platform, TD Focus ScanRX - Also available as a card stack solut
ion. Key Improvements 1. Data acquisition is significantly faster than current design 2. Better aesthetic – closely aligns with HandyScan RX 3. Improved IP rating (Target IP66) 4. Ruggedized housing 5. Connectors are protected from impact and ingress 6. Integrated stand and separate retractable handle easy to keep clean) 7. Touchscreen with ruggedized display glass 8. 3-Axis encoder input
FAAST-PA! OEM Patented phased Array for high speed UT inspection
Multiangle, Multifocus, Multifrequency, Multibeam. Instead of stacking UT electronics and having m
any PA probes, FAAST-PA is able to transmit all delay laws within ONE single shot in Real time.
Conformable wedge transducer
The conformability is obtained with a flexible membrane filled with water between the transducer and
the inspected component. The coupling between the membrane and the component requires a small quantity of water or couplant. The conformable wedge combines the acoustic performance of immersion technique with good coupling and low attenuation.