where expertise comes together
- since 1996 -
- since 1996 -
Lyft™: Pulsed Eddy Current Reinvented
PEC Reinvented—CUI Programs Redefined Corrosion under insulation (CUI) is possibly the greatest u
nresolved asset integrity problem in the industry. Current methods for measuring wall thickness with liftoff, without removing insulation, all have severe limitations. Eddyfi introduces Lyft — a reinvented, high-performance pulsed eddy current (PEC) solution. The patent- pending system features a state-of-the-art portable instrument, real- time C-scan imaging, fast data acquisition with grid-mapping and dynamic scanning modes, and flexibility with long cables. It can also scan through thick metal and insulation, as well as aluminum, stainless steel, and galvanized steel weather jackets. Who else but Eddyfi to reinvent an eddy current technique and redefine CUI programs. Got Lyft?
NDTkit RT, TESTIA's Digital Radiography software The NDTkit product line software for X-ray analysi
s. NDTkit RT is a software benefiting from the Ultis kernel which is dedicated to radiographic image analysis. It offers a set of tools and filtering processes to assist RT operators in finding relevant flaws.
MIZ®-21C: Truly Affordable Eddy Current Handheld with Surface Array Capability
Introducing MIZ-21C, the first truly affordable handheld eddy current instrument with surface array
capabilities. MIZ-21C can deliver fast, accurate inspections in demanding NDT applications including aerospace, oil and gas, manufacturing, and power generation. The surface array solution can reduce inspection time by up to 95% compared to traditional handheld pencil probes. The ergonomic design, long battery life, and intuitive touchscreen mean you can inspect more areas faster than ever without fatigue.
Combination of Digital Image Correlation and Thermographic Measurements
The combination of measuring results from the digital image correlation (ARAMIS, DIC) and temperat
ure measuring data from infrared cameras permits the simultaneous analysis of the thermal and mechanical behavior of test specimens in the materials and components testing field.