where expertise comes together
- since 1996 -
- since 1996 -
Combination of Digital Image Correlation and Thermographic Measurements
The combination of measuring results from the digital image correlation (ARAMIS, DIC) and temperat
ure measuring data from infrared cameras permits the simultaneous analysis of the thermal and mechanical behavior of test specimens in the materials and components testing field.
Research and Application Development For NDT
Acuren’s Research and Application Development specializes in the development of advanced ultraso
nic inspection techniques and systems for challenging inspection applications, with an emphasis on practical solutions which are field deployable. Services include manual and automated ultrasonic inspection system development, inspection technique optimization using laboratory scale studies and ultrasonic modeling (CIVA, BeamTool), preparing technical justification for technique evaluation and qualification (Probability of Detection and sizing accuracy studies), inspection/calibration/analysis procedure preparation to support field deployment of custom techniques, and development of custom imaging algorithms to support challenging inspection applications.
Typical Phased Array probes have frequencies between 1MHz and 20MHz and the number of wafers is 10
to 128. M2 Electronics offers customers conventionally ultrasound probes and the ability to provide high-precision Phased Array Ultrasound Probes of up to 256 wafers. We can also customize the probe for our customers to meet the specific application requirements of the user.
Wireless TOFD scanner
Quick, accurate and highly reproducible welds testing. The System operates wirelessly and is compat
ible with any type of Windows based Laptop, Desktop or Tablet.