- since 1996 -
Combination of Digital Image Correlation and Thermographic Measurements
The combination of measuring results from the digital image correlation (ARAMIS, DIC) and temperat
ure measuring data from infrared cameras permits the simultaneous analysis of the thermal and mechanical behavior of test specimens in the materials and components testing field.
Varex Imaging Large Field of View (FOV) Digital Detector Arrays (DDAs)
A larger FOV DDA can reduce the space and volume of the X-ray inspection system on the factory floor
, enable faster scanning times, better throughput and better resolution images at a lower dose. Customers can also save time and money. With these benefits in mind, Varex Imaging has designed a family of large FOV detectors (4343HE, XRD 1611, 4343DX-I, 4343CT) for our industrial imaging customers.
IRIS 9000Plus - Introducing the next generation of heat exchanger inspection.
Representing the seventh generation of the IRIS system, the IRIS 9000 Plus has nearly 200 years of c
ombined field inspection experience incorporated in its design. This experience combined with a strong commitment to quality and a history of innovation has made Iris Inspection Services® the undisputed leader in IRIS technology.
Typical Phased Array probes have frequencies between 1MHz and 20MHz and the number of wafers is 10
to 128. M2 Electronics offers customers conventionally ultrasound probes and the ability to provide high-precision Phased Array Ultrasound Probes of up to 256 wafers. We can also customize the probe for our customers to meet the specific application requirements of the user.