- since 1996 -
Combination of Digital Image Correlation and Thermographic Measurements
The combination of measuring results from the digital image correlation (ARAMIS, DIC) and temperat
ure measuring data from infrared cameras permits the simultaneous analysis of the thermal and mechanical behavior of test specimens in the materials and components testing field.
NEW - TD Focus-ScanRX
The NEW Next Generation Advanced UT platform, TD Focus ScanRX - Also available as a card stack solut
ion. Key Improvements 1. Data acquisition is significantly faster than current design 2. Better aesthetic – closely aligns with HandyScan RX 3. Improved IP rating (Target IP66) 4. Ruggedized housing 5. Connectors are protected from impact and ingress 6. Integrated stand and separate retractable handle easy to keep clean) 7. Touchscreen with ruggedized display glass 8. 3-Axis encoder input
Wireless TOFD scanner
Quick, accurate and highly reproducible welds testing. The System operates wirelessly and is compat
ible with any type of Windows based Laptop, Desktop or Tablet.
Next generation for Phased Array UT is here now with FMC/TFM! Have higher resolution imaging, impr
oved signal to noise ratio, characterize, size and analyze defects better with access to several wave mode views and save raw FMC data for higher quality analysis. Some of the benefits are: