- since 1996 -
Combination of Digital Image Correlation and Thermographic Measurements
The combination of measuring results from the digital image correlation (ARAMIS, DIC) and temperat
ure measuring data from infrared cameras permits the simultaneous analysis of the thermal and mechanical behavior of test specimens in the materials and components testing field.
Next generation for Phased Array UT is here now with FMC/TFM! Have higher resolution imaging, impr
oved signal to noise ratio, characterize, size and analyze defects better with access to several wave mode views and save raw FMC data for higher quality analysis. Some of the benefits are:
nanoVoxel series has nano-scale resolution upto 500nm by using high voltage X-ray source (from 80-
300 kV) with micro/nano focal spot and highly sensitive flat panel detectors and unique Optical coupling detector.
Compact NDT inspection-heads for measurements with active thermography
The compact inspection head is suitable for thermographic ndt tasks. The uncooled infrared camera
is specially developed for NDI-tasks and offers a thermal sensitivity until now known only from thermal imagers with cooled detector. All required components and functions are integrated into the inspection-head. You will only need an ethernet cable to connect the sensor with the evaluation system.