- since 1996 -
CIVA 2020 UT Module
CIVA NDE Simulation Software is the world leader of NDT Simulation. The UT simulation Module incl
udes: - "Beam computation": Beam propagation simulation - "Inspection Simulation": Beam interaction with flaws or specimens The user can simulate a whole inspection process (pulse echo, tandem or TOFD) with a wide range of probes (conventional, Phased- arrays or EMAT), components, and flaws.
Cygnus 6+ PRO Multi-Mode Ultrasonic Thickness Gauge
The Cygnus 6+ PRO thickness gauge is the most advance gauge within the Cygnus range with key featu
res including: comprehensive data logging; A-scan and B-scan display; manual gain control; Bluetooth connectivity; and much more. With its unique dual display and three measuring modes (Multiple-Echo, Echo-Echo and Single-Echo), this surface thickness gauge offers maximum versatility for inspections.
Pulse thermography is a non-contact test method that is ideal for the characterization of thin fil
ms and coatings or the detection of defects. With a remarquable short test time and a high detection sensitivity, the Telops TESTD-PT is the perfect tool for non- destructive testing. With such high frame rates, it is even possible to investigate highly conductive or diffusive materials.
NEW - TD Focus-ScanRX
The NEW Next Generation Advanced UT platform, TD Focus ScanRX - Also available as a card stack solut
ion. Key Improvements 1. Data acquisition is significantly faster than current design 2. Better aesthetic – closely aligns with HandyScan RX 3. Improved IP rating (Target IP66) 4. Ruggedized housing 5. Connectors are protected from impact and ingress 6. Integrated stand and separate retractable handle easy to keep clean) 7. Touchscreen with ruggedized display glass 8. 3-Axis encoder input