- since 1996 -
Combination of Digital Image Correlation and Thermographic Measurements
The combination of measuring results from the digital image correlation (ARAMIS, DIC) and temperat
ure measuring data from infrared cameras permits the simultaneous analysis of the thermal and mechanical behavior of test specimens in the materials and components testing field.
Pulse thermography is a non-contact test method that is ideal for the characterization of thin fil
ms and coatings or the detection of defects. With a remarquable short test time and a high detection sensitivity, the Telops TESTD-PT is the perfect tool for non- destructive testing. With such high frame rates, it is even possible to investigate highly conductive or diffusive materials.
Ultrasonic Probe Recharacterization Service
NDT Systems offers a comprehensive Aftercare and Recharacterization Service for all our ultrasonic
probes. The Recharacterization Service is fully compliant with International ASTM E1065 Standard Guide (and other applicable standards) and offers complete documentation, traceable to the ASTM E1065 Standard. For more details or to schedule Recharacterization Services contact email@example.com
Typical Phased Array probes have frequencies between 1MHz and 20MHz and the number of wafers is 10
to 128. M2 Electronics offers customers conventionally ultrasound probes and the ability to provide high-precision Phased Array Ultrasound Probes of up to 256 wafers. We can also customize the probe for our customers to meet the specific application requirements of the user.