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J.B.
J.B.
23:19 Jan-03-2017
Tap Testing vs. Thermography
Overall

This is a very academic article, which lacks the practical aspects. The specimen are nontypical for the field of application of those techniques. Coin/Taptest are typically used as first step approaches to test delamination or debonding in FRPs, Sandwich and Metal/Metal bonds. But such simple samples are in no way representing the reality of industrial applications.
I would recommend the authors and as well the readers to take notice of the work published by the SAE CACRC ITG (SAE Commercial Aircraft Composite Repair Committee, Inspection Task Group) conducted by the FAA AANC at the Sandia Labs in Albuquerque. You can find all relevant documents at the SAE Homepage, or search the Internet for papers from Dennis Roach about POD - here some examples - e.g.:
- https://www.niar.wichita.edu/niarworkshops/Portals/0/Friday_800_Roach.pdf
- https://www.niar.wichita.edu/niarworkshops/Portals/0/Friday_800_Roach.pdf
- http://prod.sandia.gov/techlib/access-control.cgi/2003/032112.pdf
- https://www.osti.gov/scitech/servlets/purl/1115463
- http://www.tc.faa.gov/its/worldpac/techrpt/tc15-6.pdf
- http://www.tc.faa.gov/its/worldpac/techrpt/tc15-4.pdf
There is an ongoing work described, which started about more than 15 years ago and it is permanently updated. especially the POD studies are the airworthiness authority accepted POD data form real field exercises and specific Validation Center results. If you check the contributors list, you see the world recognized major drivers
in the aeronautical industrial NDT Business with the most experience.
I would minimum expect, that if staring such a study, the Autors take notice of the state of the art. I miss any reference to these basic data in the paper.

    
 
 

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