- since 1996 -
Combination of Digital Image Correlation and Thermographic Measurements
The combination of measuring results from the digital image correlation (ARAMIS, DIC) and temperat
ure measuring data from infrared cameras permits the simultaneous analysis of the thermal and mechanical behavior of test specimens in the materials and components testing field.
HARDNESS TESTER TKM-459CE combi
TKM-459CE combi applies 2 methods of hardness control: UCI and Leeb. It provides high-accuracy tes
ting of metals and alloys as well as items of different sizes and configurations, their hardened layers and galvanic coatings. Device represents results in HB, HRC, HV and others. Shock-, dust- and water-proof housing with intuitive software make this gauge easy to use in all working conditions.
GEKKO, Standard and Advanced phased-array for Easier inspection
M2M Gekko® is a field-proven flaw detector offering PAUT, UT, TOFD and TFM through the streamline
d user interface Capture™. Released in 32:128, 64:64 or 64:128 channel configurations, Gekko combines high- resolution and speed while reducing inspectors’ training time.
Compact NDT inspection-heads for measurements with active thermography
The compact inspection head is suitable for thermographic ndt tasks. The uncooled infrared camera
is specially developed for NDI-tasks and offers a thermal sensitivity until now known only from thermal imagers with cooled detector. All required components and functions are integrated into the inspection-head. You will only need an ethernet cable to connect the sensor with the evaluation system.