- since 1996 -
Combination of Digital Image Correlation and Thermographic Measurements
The combination of measuring results from the digital image correlation (ARAMIS, DIC) and temperat
ure measuring data from infrared cameras permits the simultaneous analysis of the thermal and mechanical behavior of test specimens in the materials and components testing field.
Surf-X® Array Probe
Introducing the Surf-X family of flexible Eddy Current Array (ECA) probes. Featuring unique multiple
coil sets and proprietary X-PROBE technology, Surf-X array probes can quickly and accurately handle a range of inspection applications, from inspecting corrosion or cracking in pipes, pressure vessels, or tanks, to assessing and sizing cracks in raised welds and friction stir welds.
Compact NDT inspection-heads for measurements with active thermography
The compact inspection head is suitable for thermographic ndt tasks. The uncooled infrared camera
is specially developed for NDI-tasks and offers a thermal sensitivity until now known only from thermal imagers with cooled detector. All required components and functions are integrated into the inspection-head. You will only need an ethernet cable to connect the sensor with the evaluation system.
Ultrasonic Testing Immersion Tanks with Unmatched Scanning Features
TecScan’s non-destructive testing Ultrasonic Immersion Tanks & scanners are designed for high pe
rformance and demanding NDT testing applications. Our Scan3D™ line of High Precision Immersion Tanks are specifically designed for automated ultrasonic testing of complex composites parts used in aerospace and industrial applications.