where expertise comes together - since 1996 -

The Largest Open Access Portal of Nondestructive Testing (NDT)

Conference Proceedings, Articles, News, Exhibition, Forum, Network and more

where expertise comes together
- since 1996 -
1223 views
Technical Discussions
Peter Bergmann
Peter Bergmann
04:58 Mar-23-2000
Problem: detection of defects at soldered joint

Dear NDT experts,

could anybody give me information concerning the following NDT problem:
I have to detect defects in soldered, non ferromagnetic components with curved surfaces. The 0.1mm - defects (pore spaces) at the soldered joints are located in a depth of up to 5mm below the accessible surface.
A NDE method is required which is suitable for the integration in a manufacturing process. The concerning components vary very much in their shapes. So no scanning ultrasound or scanning eddy current method seems to be suitable.

Thank you very much

Thomas



 
 Reply 
 
Hertlin
Hertlin
05:37 Mar-23-2000
Re: Problem: detection of defects at soldered joint
: Dear NDT experts,

: could anybody give me information concerning the following NDT problem:
: I have to detect defects in soldered, non ferromagnetic components with curved surfaces. The 0.1mm - defects (pore spaces) at the soldered joints are located in a depth of up to 5mm below the accessible surface.
: A NDE method is required which is suitable for the integration in a manufacturing process. The concerning components vary very much in their shapes. So no scanning ultrasound or scanning eddy current method seems to be suitable.

: Thank you very much

: Thomas

We have an alternative NDT method that may be suitable for such components: acoustic resonant testing. Necessary is that the part "sounds" when you hit it. Our resonant testing equipement is designed for in-process testing (decision typically less than one second!). Have a look on our home page or please send us more information about your part.
Best regards
Ingolf Hertlin



 
 Reply 
 
Rod Martin
Sales,
NDT Equipment Sales Pty Limited, Australia, Joined Oct 1999, 10

Rod Martin

Sales,
NDT Equipment Sales Pty Limited,
Australia,
Joined Oct 1999
10
03:49 Mar-24-2000
Re: Problem: detection of defects at soldered joint
: Dear NDT experts,

: could anybody give me information concerning the following NDT problem:
: I have to detect defects in soldered, non ferromagnetic components with curved surfaces. The 0.1mm - defects (pore spaces) at the soldered joints are located in a depth of up to 5mm below the accessible surface.
: A NDE method is required which is suitable for the integration in a manufacturing process. The concerning components vary very much in their shapes. So no scanning ultrasound or scanning eddy current method seems to be suitable.

: Thank you very much

: Thomas

Dear Ingolf,
Would suggest you consider Thermal Wave Imaging for you application. TWI is a method of injecting a low amount of heat into an object and grabbing the various frames throughout the cooling period. This is a quick methodology and can be applied to a manufacturing process. Should you care to send a sample with known defects, please contact me direct on the above email address.

Yours faithfully


Rod Martin



 
 Reply 
 
J. Mark Davis
Teacher, And Consultant
University of Ultrasonics, Birmingham, Alabama, USA, Joined Mar 2000, 85

J. Mark Davis

Teacher, And Consultant
University of Ultrasonics, Birmingham, Alabama,
USA,
Joined Mar 2000
85
03:02 Mar-24-2000
Re: Problem: detection of defects at soldered joint
: Dear NDT experts,

: could anybody give me information concerning the following NDT problem:
: I have to detect defects in soldered, non ferromagnetic components with curved surfaces. The 0.1mm - defects (pore spaces) at the soldered joints are located in a depth of up to 5mm below the accessible surface.
: A NDE method is required which is suitable for the integration in a manufacturing process. The concerning components vary very much in their shapes. So no scanning ultrasound or scanning eddy current method seems to be suitable.

: Thank you very much

: Thomas

Dear Thomas,

Have you considered microfocus digital radiograpy using geometric enlargement. If there are many parts high production is a must. This has great promise with imaging and geometric enlargement.

I have imaged solder joints from "film" to about .005 to .010 inches with no problem. And, I can see even smaller pores through contrast enhancement and enlargement to see the pores. Also, using color (based on density) to enhance evaluation allows accurate sizing of the pores.

If you can produce a radiograph of a solder joint and express mail to it me I will scan and digital enhance the radiograph to view the joints.

Will you be at the ASNT Conference in Birmingham, AL next week? I am the Host Chairman and I will be looking at some film for a petrochemical plant. I can scan your film that week.

Sincerely,

J. Mark Davis




 
 Reply 
 
andy cunningham
Consultant, NDT/QA QC/R&D
ASNT,PCN, Canada, Joined Feb 2000, 14

andy cunningham

Consultant, NDT/QA QC/R&D
ASNT,PCN,
Canada,
Joined Feb 2000
14
03:46 Mar-24-2000
Re: Problem: detection of defects at soldered joint
: Dear NDT experts,

: could anybody give me information concerning the following NDT problem:
: I have to detect defects in soldered, non ferromagnetic components with curved surfaces. The 0.1mm - defects (pore spaces) at the soldered joints are located in a depth of up to 5mm below the accessible surface.
: A NDE method is required which is suitable for the integration in a manufacturing process. The concerning components vary very much in their shapes. So no scanning ultrasound or scanning eddy current method seems to be suitable.

: Thank you very much

: Thomas

have you tryed x ray using 2 or 3 films in one cassette and view them laminated as one film. (theory is more silver, the more sensitive.
we had great success when u/t faild in inspecting aluminum bonded cooling fins.
there are more complex ut methods that was used on the JET's project in the UK, but that 50mm x75mm thick copper solderd joints. ut was my only option due to thickness. if it is possible could you be more specific
ithe more information the more help!



 
 Reply 
 

Product Spotlight

NEW! The PragmaPro Instrument Platform

The PragmaPro is based on a modular cartridge technology and supports various NDT instrument modal
...
ities such as UT, PAUT, ECT and many more. This new platform is based on a machined, powder-coated aluminum frame for shock-proofness, best sealing qualities and maximum heat dissipation. This is practical to extend the outdoor temperature range and/or to extend the power injected in the transducers. The PragmaPro is aiming at a very wide range of applications, such as weld scanning, corrosion mapping and composite testing.
>

YXLON Cougar EVO

Scalable small footprint X-ray inspection systems for assembly and laboratory applications. The
...
YXLON Cougar EVO series was designed to provide the "best-in- class" inspection solutions for SMT, semiconductor, and laboratory assembly applications, while maintaining a small system footprint for maximum convenience. With optimized software and hardware, these systems produce higher quality and more consistent results than other electronics inspection systems currently on the market.
>

Combination of Digital Image Correlation and Thermographic Measurements

The combination of measuring results from the digital image correlation (ARAMIS, DIC) and temperat
...
ure measuring data from infrared cameras permits the simultaneous analysis of the thermal and mechanical behavior of test specimens in the materials and components testing field.
>

IntraPhase Athena Phased Array System

The Athena Phased Array system, manufactured by WesDyne NDE Products & Technology, consists of a pha
...
sed array acquisition system and PC running IntraSpect software. A PC is used to perform acquisition, analysis and storage of the data. System hardware is capable of operating up to four data sets with any combination of phased array or conventional UT probes. NOW AVAILABLE IN 64-64 CONFIGURATION.
>

Share...
We use technical and analytics cookies to ensure that we will give you the best experience of our website - More Info
Accept
top
this is debug window