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where expertise comes together
- since 1996 -
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Technical Discussions
Yoseph Bar-Cohen
R & D,
Jet Propulsion Lab (JPL), USA, Joined Nov 1998, 26

Yoseph Bar-Cohen

R & D,
Jet Propulsion Lab (JPL),
USA,
Joined Nov 1998
26
08:38 Mar-24-2000
Ice Sensor

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Product Spotlight

Lyft™: Pulsed Eddy Current Reinvented

PEC Reinvented—CUI Programs Redefined Corrosion under insulation (CUI) is possibly the greatest u
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nresolved asset integrity problem in the industry. Current methods for measuring wall thickness with liftoff, without removing insulation, all have severe limitations. Eddyfi introduces Lyft — a reinvented, high-performance pulsed eddy current (PEC) solution. The patent- pending system features a state-of-the-art portable instrument, real- time C-scan imaging, fast data acquisition with grid-mapping and dynamic scanning modes, and flexibility with long cables. It can also scan through thick metal and insulation, as well as aluminum, stainless steel, and galvanized steel weather jackets. Who else but Eddyfi to reinvent an eddy current technique and redefine CUI programs. Got Lyft?
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HD-CR 35 NDT Computed Radiography System

Portable high-resolution CR scanner for all radiography applications - weld testing, profile images
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and aerospace. No matter what type of radiographic testing you are performing, the unique TreFoc Technology of the HD-CR 35 NDT imaging plate scanner always guarantees the highest image quality.
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Ultrasonic tomograph for imaging of concrete structures А1040 MIRA

Applicable for concrete inspection allowing imaging of the internal structure of objects from conc
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rete, reinforced concrete, different stones. The operation applies pulse-echo technique at one-side access to the object. The instrument is feasible for concrete inspection for searching conduct ducts, conduits, detection of foreign inclusions, holes, honeycombing, cracks and other concrete defects.
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YXLON Cougar EVO

Scalable small footprint X-ray inspection systems for assembly and laboratory applications. The
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YXLON Cougar EVO series was designed to provide the "best-in- class" inspection solutions for SMT, semiconductor, and laboratory assembly applications, while maintaining a small system footprint for maximum convenience. With optimized software and hardware, these systems produce higher quality and more consistent results than other electronics inspection systems currently on the market.
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