where expertise comes together
- since 1996 -
- since 1996 -
Lyft™: Pulsed Eddy Current Reinvented
PEC Reinvented—CUI Programs Redefined Corrosion under insulation (CUI) is possibly the greatest u
nresolved asset integrity problem in the industry. Current methods for measuring wall thickness with liftoff, without removing insulation, all have severe limitations. Eddyfi introduces Lyft — a reinvented, high-performance pulsed eddy current (PEC) solution. The patent- pending system features a state-of-the-art portable instrument, real- time C-scan imaging, fast data acquisition with grid-mapping and dynamic scanning modes, and flexibility with long cables. It can also scan through thick metal and insulation, as well as aluminum, stainless steel, and galvanized steel weather jackets. Who else but Eddyfi to reinvent an eddy current technique and redefine CUI programs. Got Lyft?
NEW - TD Focus-ScanRX
The NEW Next Generation Advanced UT platform, TD Focus ScanRX - Also available as a card stack solut
ion. Key Improvements 1. Data acquisition is significantly faster than current design 2. Better aesthetic – closely aligns with HandyScan RX 3. Improved IP rating (Target IP66) 4. Ruggedized housing 5. Connectors are protected from impact and ingress 6. Integrated stand and separate retractable handle easy to keep clean) 7. Touchscreen with ruggedized display glass 8. 3-Axis encoder input
Cygnus 6+ PRO Multi-Mode Ultrasonic Thickness Gauge
The Cygnus 6+ PRO thickness gauge is the most advance gauge within the Cygnus range with key featu
res including: comprehensive data logging; A-scan and B-scan display; manual gain control; Bluetooth connectivity; and much more. With its unique dual display and three measuring modes (Multiple-Echo, Echo-Echo and Single-Echo), this surface thickness gauge offers maximum versatility for inspections.
CIVA 2017 UT Module
CIVA NDE Simulation Software is the world leader of NDT Simulation. The UT simulation Module incl
udes: - "Beam computation": Beam propagation simulation - "Inspection Simulation": Beam interaction with flaws or specimens The user can simulate a whole inspection process (pulse echo, tandem or TOFD) with a wide range of probes (conventional, Phased- arrays or EMAT), components, and flaws.