- since 1996 -
Lyft™: Pulsed Eddy Current Reinvented
PEC Reinvented—CUI Programs Redefined Corrosion under insulation (CUI) is possibly the greatest u
nresolved asset integrity problem in the industry. Current methods for measuring wall thickness with liftoff, without removing insulation, all have severe limitations. Eddyfi introduces Lyft — a reinvented, high-performance pulsed eddy current (PEC) solution. The patent- pending system features a state-of-the-art portable instrument, real- time C-scan imaging, fast data acquisition with grid-mapping and dynamic scanning modes, and flexibility with long cables. It can also scan through thick metal and insulation, as well as aluminum, stainless steel, and galvanized steel weather jackets. Who else but Eddyfi to reinvent an eddy current technique and redefine CUI programs. Got Lyft?
Pulse thermography is a non-contact test method that is ideal for the characterization of thin fil
ms and coatings or the detection of defects. With a remarquable short test time and a high detection sensitivity, the Telops TESTD-PT is the perfect tool for non- destructive testing. With such high frame rates, it is even possible to investigate highly conductive or diffusive materials.
The all-digital Novascope 6000 is a portable, ultra-high precision thickness gauge for high-speed
thickness measurement. Novascope 6000 has unmatched capabilities and unique features including: •Superior Resolution with high contrast, high-speed color RF display •High pulser voltage •Real-time video output •Increased internal/external data storage •Programmable SetUp features •Battery & AC Powered
Compact NDT inspection-heads for measurements with active thermography
The compact inspection head is suitable for thermographic ndt tasks. The uncooled infrared camera
is specially developed for NDI-tasks and offers a thermal sensitivity until now known only from thermal imagers with cooled detector. All required components and functions are integrated into the inspection-head. You will only need an ethernet cable to connect the sensor with the evaluation system.