- since 1996 -
Combination of Digital Image Correlation and Thermographic Measurements
The combination of measuring results from the digital image correlation (ARAMIS, DIC) and temperat
ure measuring data from infrared cameras permits the simultaneous analysis of the thermal and mechanical behavior of test specimens in the materials and components testing field.
NEW! The PragmaPro Instrument Platform
The PragmaPro is based on a modular cartridge technology and supports various NDT instrument modal
ities such as UT, PAUT, ECT and many more. This new platform is based on a machined, powder-coated aluminum frame for shock-proofness, best sealing qualities and maximum heat dissipation. This is practical to extend the outdoor temperature range and/or to extend the power injected in the transducers. The PragmaPro is aiming at a very wide range of applications, such as weld scanning, corrosion mapping and composite testing.
Lyft™: Pulsed Eddy Current Reinvented
PEC Reinvented—CUI Programs Redefined Corrosion under insulation (CUI) is possibly the greatest u
nresolved asset integrity problem in the industry. Current methods for measuring wall thickness with liftoff, without removing insulation, all have severe limitations. Eddyfi introduces Lyft — a reinvented, high-performance pulsed eddy current (PEC) solution. The patent- pending system features a state-of-the-art portable instrument, real- time C-scan imaging, fast data acquisition with grid-mapping and dynamic scanning modes, and flexibility with long cables. It can also scan through thick metal and insulation, as well as aluminum, stainless steel, and galvanized steel weather jackets. Who else but Eddyfi to reinvent an eddy current technique and redefine CUI programs. Got Lyft?
NDTkit RT, TESTIA's Digital Radiography software The NDTkit product line software for X-ray analysi
s. NDTkit RT is a software benefiting from the Ultis kernel which is dedicated to radiographic image analysis. It offers a set of tools and filtering processes to assist RT operators in finding relevant flaws.