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where expertise comes together
- since 1996 -

LECOEUR ELECTRONIQUE
The Specialist of electronics for ultrasonic testing

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Job Seeks
david morais
david morais
00:43 Mar-15-2007
Insulation Qa/QC inspector

Job Location: Any

Looking for insulation project supervisor or QA/QC inspector job


 
 

Product Spotlight

TraiNDE UT

TraiNDE UT is a virtual tool associated with a signal database which simulates real inspection con
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ditions for numerous applications (Type A/V1 block, DAC block, welds and plates).
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Research and Application Development For NDT

Acuren’s Research and Application Development specializes in the development of advanced ultraso
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nic inspection techniques and systems for challenging inspection applications, with an emphasis on practical solutions which are field deployable. Services include manual and automated ultrasonic inspection system development, inspection technique optimization using laboratory scale studies and ultrasonic modeling (CIVA, BeamTool), preparing technical justification for technique evaluation and qualification (Probability of Detection and sizing accuracy studies), inspection/calibration/analysis procedure preparation to support field deployment of custom techniques, and development of custom imaging algorithms to support challenging inspection applications.
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Cygnus 6+ PRO Multi-Mode Ultrasonic Thickness Gauge

The Cygnus 6+ PRO thickness gauge is the most advance gauge within the Cygnus range with key featu
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res including: comprehensive data logging; A-scan and B-scan display; manual gain control; Bluetooth connectivity; and much more. With its unique dual display and three measuring modes (Multiple-Echo, Echo-Echo and Single-Echo), this surface thickness gauge offers maximum versatility for inspections.
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CIVA 2020 UT Module

CIVA NDE Simulation Software is the world leader of NDT Simulation. The UT simulation Module incl
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udes: - "Beam computation": Beam propagation simulation - "Inspection Simulation": Beam interaction with flaws or specimens The user can simulate a whole inspection process (pulse echo, tandem or TOFD) with a wide range of probes (conventional, Phased- arrays or EMAT), components, and flaws.
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