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where expertise comes together
- since 1996 -

Materials Research Institute
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Job Offers
Leo David
Leo David
03:09 Apr-24-2008
ET Inspector or Eddy current Level II

Posted by  
Job Location: Singapore

We have an immediate requirement for ET inspectors in Singapore. Indians are preferred. Please contact us at ndtsupplies@airtelmail.in



 
 

Product Spotlight

HARDNESS TESTER TKM-459CE combi

TKM-459CE combi applies 2 methods of hardness control: UCI and Leeb. It provides high-accuracy tes
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ting of metals and alloys as well as items of different sizes and configurations, their hardened layers and galvanic coatings. Device represents results in HB, HRC, HV and others. Shock-, dust- and water-proof housing with intuitive software make this gauge easy to use in all working conditions.
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CIVA 2020 UT Module

CIVA NDE Simulation Software is the world leader of NDT Simulation. The UT simulation Module incl
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udes: - "Beam computation": Beam propagation simulation - "Inspection Simulation": Beam interaction with flaws or specimens The user can simulate a whole inspection process (pulse echo, tandem or TOFD) with a wide range of probes (conventional, Phased- arrays or EMAT), components, and flaws.
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UCI Hardness Tester NOVOTEST T-U2

UCI hardness tester NOVOTEST T-U2 is is used for non-destructive hardness testing of: metals and
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alloys by scales of hardness: Rockwell (HRC), Brinell (HB), Vickers (HV); non-ferrous metals, alloys of iron etc., and using five additional scales for calibration; with tensile strength (Rm) scale determines the tensile strength of carbon steel pearlitic products by automatic recalculation from Brinell (HB) hardness scale.
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PAUT Probes

Typical Phased Array probes have frequencies between 1MHz and 20MHz and the number of wafers is 10
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to 128. M2 Electronics offers customers conventionally ultrasound probes and the ability to provide high-precision Phased Array Ultrasound Probes of up to 256 wafers. We can also customize the probe for our customers to meet the specific application requirements of the user.
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