where expertise comes together
- since 1996 -
- since 1996 -
Lyft™: Pulsed Eddy Current Reinvented
PEC Reinvented—CUI Programs Redefined Corrosion under insulation (CUI) is possibly the greatest u
nresolved asset integrity problem in the industry. Current methods for measuring wall thickness with liftoff, without removing insulation, all have severe limitations. Eddyfi introduces Lyft — a reinvented, high-performance pulsed eddy current (PEC) solution. The patent- pending system features a state-of-the-art portable instrument, real- time C-scan imaging, fast data acquisition with grid-mapping and dynamic scanning modes, and flexibility with long cables. It can also scan through thick metal and insulation, as well as aluminum, stainless steel, and galvanized steel weather jackets. Who else but Eddyfi to reinvent an eddy current technique and redefine CUI programs. Got Lyft?
EKOSCAN Phased Array
In order to always fit your needs, EKOSCAN can manufacture any type of UT transducer, either convent
ional or Phased Array. As an ISO 9001: 2015 certified company, EKOSCAN is extremely careful as far a material selection and manufacturing processes are concerned. Our probes guarantee our customers the benefits of latest innovations regarding piezo-composite, backing, impedance adaptation layer, etc. Specific probes for hostile environment: high temperature, high pressure, corrosive environment,etc. Specific probes designed to fit your specific application: optimization of every parameter to guarantee you the best detection.
CIVA 2020 UT Module
CIVA NDE Simulation Software is the world leader of NDT Simulation. The UT simulation Module incl
udes: - "Beam computation": Beam propagation simulation - "Inspection Simulation": Beam interaction with flaws or specimens The user can simulate a whole inspection process (pulse echo, tandem or TOFD) with a wide range of probes (conventional, Phased- arrays or EMAT), components, and flaws.
Combination of Digital Image Correlation and Thermographic Measurements
The combination of measuring results from the digital image correlation (ARAMIS, DIC) and temperat
ure measuring data from infrared cameras permits the simultaneous analysis of the thermal and mechanical behavior of test specimens in the materials and components testing field.