where expertise comes together
- since 1996 -
- since 1996 -
Combination of Digital Image Correlation and Thermographic Measurements
The combination of measuring results from the digital image correlation (ARAMIS, DIC) and temperat
ure measuring data from infrared cameras permits the simultaneous analysis of the thermal and mechanical behavior of test specimens in the materials and components testing field.
Pulse thermography is a non-contact test method that is ideal for the characterization of thin fil
ms and coatings or the detection of defects. With a remarquable short test time and a high detection sensitivity, the Telops TESTD-PT is the perfect tool for non- destructive testing. With such high frame rates, it is even possible to investigate highly conductive or diffusive materials.
FAAST-PA! OEM Patented phased Array for high speed UT inspection
Multiangle, Multifocus, Multifrequency, Multibeam. Instead of stacking UT electronics and having m
any PA probes, FAAST-PA is able to transmit all delay laws within ONE single shot in Real time.
CIVA 2017 UT Module
CIVA NDE Simulation Software is the world leader of NDT Simulation. The UT simulation Module incl
udes: - "Beam computation": Beam propagation simulation - "Inspection Simulation": Beam interaction with flaws or specimens The user can simulate a whole inspection process (pulse echo, tandem or TOFD) with a wide range of probes (conventional, Phased- arrays or EMAT), components, and flaws.