- since 1996 -
Combination of Digital Image Correlation and Thermographic Measurements
The combination of measuring results from the digital image correlation (ARAMIS, DIC) and temperat
ure measuring data from infrared cameras permits the simultaneous analysis of the thermal and mechanical behavior of test specimens in the materials and components testing field.
CIVA 2020 UT Module
CIVA NDE Simulation Software is the world leader of NDT Simulation. The UT simulation Module incl
udes: - "Beam computation": Beam propagation simulation - "Inspection Simulation": Beam interaction with flaws or specimens The user can simulate a whole inspection process (pulse echo, tandem or TOFD) with a wide range of probes (conventional, Phased- arrays or EMAT), components, and flaws.
OmniScan™ X3 flaw detector
The OmniScan X3 flaw detector is a complete phased array toolbox. Powerful tools, like total focus
ing method (TFM) images and advanced visualization capabilities, enable you to complete your inspection with greater confidence.
NEW - TD Focus-ScanRX
The NEW Next Generation Advanced UT platform, TD Focus ScanRX - Also available as a card stack solut
ion. Key Improvements 1. Data acquisition is significantly faster than current design 2. Better aesthetic – closely aligns with HandyScan RX 3. Improved IP rating (Target IP66) 4. Ruggedized housing 5. Connectors are protected from impact and ingress 6. Integrated stand and separate retractable handle easy to keep clean) 7. Touchscreen with ruggedized display glass 8. 3-Axis encoder input