where expertise comes together - since 1996 -

The Largest Open Access Portal of Nondestructive Testing (NDT)

Conference Proceedings, Articles, News, Exhibition, Forum, Network and more

where expertise comes together
- since 1996 -


Technical Discussions
Yoseph Bar-Cohen
R & D,
Jet Propulsion Lab (JPL), USA, Joined Nov 1998, 26

Yoseph Bar-Cohen

R & D,
Jet Propulsion Lab (JPL),
Joined Nov 1998
03:11 Mar-01-2002
2002 Transducing Materials and Devices -- Call for Papers

Dear Colleague,

I am pleased to inform you of the first Transducing Materials and Devices Conference and I would like to invite you to submit an abstract. This international conference is an exciting opportunity for technical interactions and information exchange among developers and users of this multidisciplinary field that is very important to many areas of science and engineering. The conference is going to be held on Oct. 31 - Nov. 1, 2002 at Brugge, Belgium, and it is described on: http://spie.org/conferences/calls/02/epf/confs/PF11.html . This conference is part of the SPIE's Photonics Fabrication Europe Symposium, which is described on http://spie.org/conferences/calls/02/epf/

Submittal of abstracts is due on April 1, 2002 and the manuscript will be due on September 30, 2002. The Abstract Submission Form is available on http://butler2.spie.org/abstracts/Absin.lasso?-token=PF11

Yosi , Conference Chair
Yoseph Bar-Cohen, Ph.D., Senior Research Scientist
Group Leader, NDEAA Technologies, M&RT
Adjunct Professor, UCLA, MAE Dept.
Jet Propulsion Lab (JPL), 82-105
4800 Oak Grove Dr., Pasadena, CA 91109-8099
818-354-2610, Fax: 818-393-3254
yosi@jpl.nasa.gov http://ndeaa.jpl.nasa.gov


Product Spotlight

Combination of Digital Image Correlation and Thermographic Measurements

The combination of measuring results from the digital image correlation (ARAMIS, DIC) and temperat
ure measuring data from infrared cameras permits the simultaneous analysis of the thermal and mechanical behavior of test specimens in the materials and components testing field.

NEW - TD Focus-ScanRX

The NEW Next Generation Advanced UT platform, TD Focus ScanRX - Also available as a card stack solut
ion. Key Improvements 1. Data acquisition is significantly faster than current design 2. Better aesthetic – closely aligns with HandyScan RX 3. Improved IP rating (Target IP66) 4. Ruggedized housing 5. Connectors are protected from impact and ingress 6. Integrated stand and separate retractable handle easy to keep clean) 7. Touchscreen with ruggedized display glass 8. 3-Axis encoder input

FAAST-PA! OEM Patented phased Array for high speed UT inspection

Multiangle, Multifocus, Multifrequency, Multibeam. Instead of stacking UT electronics and having m
any PA probes, FAAST-PA is able to transmit all delay laws within ONE single shot in Real time.

SONOAIR - air-coupled Phased Array Ultrasonic Inspection System

For highly attenuating materials, the performance of the system is critical. The ultrasonic sensors,
the scanning area and the system settings should be flexibly adapted to the test task and the material. These high expectations are met with the new and modular testing system SONOAIR. With the world’s first air-coupled phased-array UT inspection system SONOAIR we developed a technology that works with up to 4 transmitter and receiver channels with freely configurable square wave burst transmitters as wells as low noise receiving amplifiers.

We use technical and analytics cookies to ensure that we will give you the best experience of our website - More Info
this is debug window