- since 1996 -
Combination of Digital Image Correlation and Thermographic Measurements
The combination of measuring results from the digital image correlation (ARAMIS, DIC) and temperat
ure measuring data from infrared cameras permits the simultaneous analysis of the thermal and mechanical behavior of test specimens in the materials and components testing field.
HARDNESS TESTER TKM-459CE combi
TKM-459CE combi applies 2 methods of hardness control: UCI and Leeb. It provides high-accuracy tes
ting of metals and alloys as well as items of different sizes and configurations, their hardened layers and galvanic coatings. Device represents results in HB, HRC, HV and others. Shock-, dust- and water-proof housing with intuitive software make this gauge easy to use in all working conditions.
Eddy Current inspection : RotoETscan Rotating Head
The rotating head RotoETscan detects the presence of longitudinal surface or sub surface defects a
t high speed. The rotating head is often installed directly on the production line. It is generally dedicated to the control of long products such as tubes, bars and wires, made of ferrous or non-ferrous material. It can also be used for inspection of small parts (billets).
Typical Phased Array probes have frequencies between 1MHz and 20MHz and the number of wafers is 10
to 128. M2 Electronics offers customers conventionally ultrasound probes and the ability to provide high-precision Phased Array Ultrasound Probes of up to 256 wafers. We can also customize the probe for our customers to meet the specific application requirements of the user.