ASTM E1444 -05 changed the wording of paragraphs 126.96.36.199 and 188.8.131.52 so that MT can be done before or after plating that is 0.0008 inch thick or less. MT is required before and after plating that is between 0.0008 and 0.005 inch. The previous version of ASTM E1444 required MT before and after all plating up to 0.005 inch. I have a plating supplier that did MT before cadmium plating but not after because cadmium is less than 0.0008 inch. I think this is a serious problem with ASTM E1444-05 because cadmium plating can cause embrittlement and MT should be done after plating if the material is greater than 160 ksi. Has anyone else had a similar problem?