- since 1996 -
|NDT.net Issue - 2011-01 - NEWS |
|Unique shielding and off-axis fiber-optic design improves imaging performance
and protects detector from radiation damage over a broad range of x-ray energies
San Jose, CA, December 6, 2010 X-Scan Imaging Corporation, announces a new member to its family of high-energy Line Scan Cameras specifically designed for imaging ultra-high-energy x-ray and gamma ray applications at energy levels to 15 MeV. Designated the XMH8800 Series, this uniquely designed assembly combines scintillation for converting high-energy photons to visible light and fiber optics for subsequently conveying the visible light to an off-axis CMOS diode array detector. A lead or tungsten body shields the diode array and integrated electronics ensuring long-life reliability under extreme radiation conditions.
High-energy accelerators and detectors such as the XMH8800 are required to image large, dense objects such as metal castings and steel objects whose thickness can range from 4 to 12 inches. The XMH8800 Camera also offers a high-performance solution for many other radiography and NDT imaging applications that can be suitably penetrated at energy levels up to 15 MeV.
Standard XMH Camera models are available in active sensor lengths ranging from 154 to 3686 mm including a broad mix of resolutions ranging from 96 to 9216 pixels on centers as small as 400-µm. Other detector lengths can be special ordered with virtually no maximum length limit.
"X-Scans clever (off-axis) optical path and architecture of the XMH8800 Camera represents a major price/performance breakthrough in extreme high-energy, line-scan technology and radiation imaging" said Dr Chinlee Wang, CEO and president of X-Scan Imaging Corporation. Reduced assembly complexity and a compact design offers users improved performance, speed and reliability nothing else on the market offers better low noise, wide dynamic range, high sensitivity performance and overall value. All XMH8800 Camera models incorporate X-Scans CMOS silicon imaging detector array chips with on-chip fully integrated signal processing circuits designed for visible wavelength and X-ray sensitive applications. The close proximity of the analog-to-digital converters (ADC) to the detector chips and the use of low-voltage-differential-signal (LVDS) technology help to minimize noise and maximize bandwidth. High sensitivity and high speed readout up to 9000 lines/second enables inspection speeds over 100 cm per second. Typical dynamic range is 4000 to 1.
Each camera includes a contiguous linear array of photodiodes, low-noise signal processing circuitry, 16-bit ADCs, digital control, and a choice of either Camera Link® or Gigabit Ethernet interface to a remote (supplied separately or by user) PC-based data acquisition system. The Gigabit Ethernet interface supports cable lengths up to 90 meters.
A segmented CdWO4 (CWO) array is mated to FOP (Fiber optics Faceplate) that is then mated to the surface of the detector array(s). This structure converts X-ray photons into visible light that is sensed by the linear array of CMOS photodiodes. Various scintillation materials and a range of thicknesses can be provided for optimizing both detector sensitivity and image resolution.
The single quantity prices start at $25K for the XMH8800, including X-ray camera head, Camera Link® Gigabit Ethernet interface box, power adapter, cabling, and X-Scans proprietary software development kit, which comes complete with software drivers, intuitive application programming interface (API), and example code software that enables rapid development of non-destructive testing (NDT) and other x-ray scanning systems. Current availability is stock to 18 weeks. Other scintillators and custom camera geometries are available as an option for special performance and energy range requirements.
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