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|NDT.net Issue - 2011-12 - NEWS |
FREMONT, CA, Nov 16, 2011 (MARKETWIRE via COMTEX) -- DCG Systems, Inc. is exhibiting at the 37th annual International Symposium for Testing and Failure Analysis (ISTFA) November 15-16 at the San Jose Convention Center. They will be in booth #401 to engage ISTFA attendees with DCG's extensive product portfolio and in particular will announce ELITE software optimized for the non-destructive 3D defect localization in packaged semiconductor devices. The ELITE has proven effective in identifying defects within stacked-die devices keeping all the packaging intact.
This new solution is designed to meet the complex challenges facing manufacturers of today's advanced stacked die technologies. The resulting complexity of such 3D architectures and the shrinking geometries of today's packages offer great performance increase and cost reduction for various applications, but also require new techniques and methodologies for effective debug and failure analysis. Therefore it is crucial to have the capability to distinguish a defect location in three dimensions in order to accurately know which die is affected.
At ISTFA, DCG Systems will also be participating in the Technical Symposium. Four different presentations will be given throughout the duration of the conference.
About DCG Systems DCG Systems, Inc., a privately held company headquartered in Fremont, California, is the leading provider of semiconductor debug and characterization solutions for the semiconductor industry. With operations in the U.S., Japan, Taiwan, Korea, Malaysia, Singapore, Israel and Germany, DCG delivers competitive cost and performance advantages to integrated device manufacturers (IDMs), wafer foundries and fabless chip companies worldwide. DCG Systems is comprised of the former Schlumberger/NPTest Probe Systems division, Optonics, Inc., Hypervision, Inc., Zyvex Instruments, LLC, and Thermosensorik GmbH, with an installed base of over 950 systems worldwide. For more information please visit www.dcgsystems.com .