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|NDT.net Issue - 2013-04 - NEWS |
MatriX Technologies introduces its high-speed inline 3D X-ray inspection system at the APEX show 2013 in San Diego|
Feldkirchen, March 7th 2013 - After successfully launching the first X3 In-line X-Ray system in November 2011, MatriX Technologies now presented its new X3L system in the USA. As of this year, besides the universal 3D inspection system X3, the X3L configuration is available with an innovative dual detector concept, combining a line-scan for transmission inspection of complete PCBs in a few seconds and a high-resolution digital flatpanel detector for selective 3D image capturing.
3D X-Ray technology is especially useful for double-sided solder joint inspection of PCB assemblies. Key application focus in SMT production (Surface Mount Technology) are hidden solder joints, especially head-in-pillow defects for BGAs and cold solder joint analysis for QFN components. Other important inspection tasks are thermal pads and PTH/THT barrel fill measurements per IPC-610 requirements.
By developing the new X3L system MatriX Technologies now offers a combination of optimized test concepts - transmission, off-axis image capturing, and 3D-SART - that selectively uses the 3D technique where it is really needed. As for typically 80% of the solder joints on double-sided boards transmission X-ray is absolutely sufficient, the X3L inspection system uses a high-speed readout TDI camera (line scanner) in parallel, reducing the image capturing process for 18x16 inch PCBs to less than 10 sec. This approach enables the user to select the optimum inspection technique based on his individual requirements.
Each X3 system is equipped with the newly developed 3D-SART (Simultaneous Algebraic Reconstruction Technique), which provides slice images for high quality solder joint analysis. 3D-SART is generating detailed, high-resolution images for a reliable analysis based on a minimum amount of projections.
The new X3 series uses the well-established MIPS platform with links to all MIPS software modules for programming, classifying and verification. MIPS verify now supports the defect image verification with an extended 3D functionality. The respective images of defects can be displayed in different acquisition modes allowing the comparison of transmission, angle shot, and 3D slice images. In case of a combined AXI/AOI configuration a common verification dialogue supplies both X-ray and optical images for efficient processing.
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