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NDT.net Issue - 2014-10 - NEWS
NDT.net Issue: 2014-10
Publication: e-Journal of Nondestructive Testing (NDT) ISSN 1435-4934 (NDT.net Journal)

Olympus Introduces the BondMaster 600 Multimode Bond Tester

Olympus Scientific Solutions Americas (OSSA)239, Waltham, MA, USA


Waltham, MA, USA, September 23, 2014 — Olympus, a world leader in nondestructive testing technologies, is pleased to announce the introduction of the new BondMaster® 600 Bond Tester that is designed to nondestructively inspect bonds in honeycomb or laminate composites or metal-to-metal parts. This portable multimode adhesive bond testing instrument uses pitch-catch modes, mechanical impedance analysis (MIA), and resonance technologies to inspect materials that are commonly used in aerospace, energy, and automotive industries.

The BondMaster 600 incorporates the latest advancements in high-performance bond testing technologies into one compact, durable unit with a vivid 5.7 inch full-screen VGA display capable of producing user-selectable, highly contrast signals in all lighting conditions.

The BondMaster 600 weighs only 1.7 kg (3.75 lbs.) and is delivered with a factory-installed hand strap that provides direct thumb access to the key controls, offering instant adjustment of commonly-used parameters. Based on an already field-proven instrument enclosure, the instrument is designed for IP66 to withstand the rigors of harsh field conditions. Its ruggedness and long battery life, allowing up to 9 hours of standard operation, makes the BondMaster 600 an instrument that can be trusted for any bond testing inspection job.

The BondMaster 600 is offered in two models to accommodate the varying needs of composite bond testing. Its basic model includes all pitch-catch mode while the BondMaster 600M multimode model features all three bond testing inspection modes including resonance and mechanical impedance analysis. Honeycomb inspection using pitch-catch is made easier by real-time readings on the display allowing easier flaw interpretation. In addition, in pitch-catch swept mode a new frequency tracking feature is useful when writing procedures or developing new applications. The resonance method with its factory application pre-sets is ideal for laminate composite and metal-to-metal disbonds. The mechanical impedance analysis (MIA) mode with its increased frequency range to 50 kHz allows identification of repaired areas and easy detection of small defects.

Reliable bonds are essential to the integrity of aircraft composite structures throughout their service life. The BondMaster 600 is a multimode instrument uniquely developed to provide complete solutions for composite bond testing applications for both manufacturing QA/QC and in the field for maintenance inspections. Its simplified workflow from data acquisition and on-board storage to full reporting and archiving, as well as its intuitive interface makes the BondMaster 600 the instrument of choice in this important market.

About Olympus
Olympus Corporation is an international precision technology leader operating in industrial, medical, academic and consumer markets, specializing in optics, electronics, and precision engineering. As a subsidiary of Olympus Corporation, Olympus Scientific Solutions Americas is an integral part of the global Olympus network with specific responsibility for the sales and marketing of life science and industrial instrumentation in the Americas. The company’s core product line-up offers clinical, educational, and research microscopes, nondestructive testing equipment, and analytical instruments all designed with the unwavering commitment to enhancing people’s lives every day and contributing to the safety, security, quality, and productivity of society.

For more information please contact:
Meindert Anderson
Corporate Director, Marketing Communications
Olympus Scientific Solutions Americas
(1) 781-419-3562

Visit: Olympus Scientific Solutions Americas (OSSA)

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