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|NDT.net Issue - 2017-10 - NEWS ||NDT.net Issue: 2017-10|
Publication: e-Journal of Nondestructive Testing (NDT) ISSN 1435-4934 (NDT.net Journal)
Zetec® to Introduce New NDT Products at ASNT 2017Zetec85, Snoqualmie, WA, USA
SNOQUALMIE, Wash. (Sept. 19, 2017)—Zetec Inc. will introduce new eddy current and ultrasonic products for the nondestructive testing (NDT) industry at the ASNT Annual Conference in Nashville, Tenn., from Oct. 30-Nov. 2.
The inspection innovations will be on display at the Zetec booth (#805), along with Zetec’s current lineup of solutions for oil and gas, aerospace, rail, maritime, power generation, manufacturing, and other industries.
In addition, Zetec will participate in the ASNT Innovation Forum presentation sessions located right on the exhibition floor. The Zetec session will take place on Oct. 31 at 12:20 p.m.
“Our new eddy current and UT solutions are game-changers for the nondestructive testing industry in terms of accuracy, productivity, and cost effectiveness,” said Wayne Wilkinson, president of Zetec. “ASNT 2017 will be the first opportunity to see these products live. If you are involved in NDT inspections, you don’t want to miss it.”
Zetec serves as single source for best-of-breed NDT technologies, including the Zetec TOPAZ® family of fully integrated, high-performance phased array UT devices; the MIZ® family of eddy current instrumentation; and the UltraVision® and RevospECT® software platforms.
ASNT 2017 will take place at the Gaylord Opryland Resort and Convention Center in Nashville. The event is the largest trade show in North America for the nondestructive testing industry. For information, visit asnt.org/annual.
Zetec is a subsidiary of Roper Technologies Inc., with global engineering and manufacturing centers in Quebec City and at our corporate headquarters in Snoqualmie, Washington. Zetec support spans the globe, with Centers of Excellence in Houston, Paris, Seoul, Shanghai, and Tokyo. For more information about Zetec, visit: zetec.com and follow us on LinkedIn and Twitter.