where expertise comes together - since 1996

Web's Largest Portal of Nondestructive Testing (NDT)
Open Access Database (Conference Proceedings, Articles, News), Exhibition, Forum, Network


NDT.net Issue - 2009-01 - NEWS

Sonoscan Announces Advanced Thickness Measurement Method


Sonoscan, Elk Grove Village, IL [USA]
NEWS  
NDT.net Journal
Issue: 2009-01
Elk Grove Village IL, September 30, 2008-- In a joint effort with a large component supplier to the cellular and video industries, Sonoscan has developed an acoustic micro imaging technique that accurately measures the thickness of the bondline of the heat spreader adhesive in advanced microprocessor assemblies, even when the bondline is so thin that individual echoes cannot be separated.

Internal thicknesses are typically measured by recording the time of an echo from the top of a layer and from the bottom of the same layer. The thickness of the bondline must be within a specific range (30 microns and 80 microns, for example) to avoid a loss of heat dissipation and consequent electrical failure.

These dimensions are too thin for the relatively low acoustic frequencies used to penetrate the metal heat spreader. The waveforms of the two echoes merge into a single echo.

The solution is to use one echo from the bondline itself and a second reference echo to extract the thickness measurements needed.

This new technique is being used with Sonoscan’s automated FACTS2™ system, which carries trays of microprocessor assemblies. Bondline thickness measurements are taken at multiple points on each assembly in order to identify a process drift as soon as possible after attachment of the heat spreader.


Sonoscan’s new technique for measuring critical bondline thickness

For more information, contact Steve Martell, manager of technical support services. Phone: 847 437-6400 x 240

Sonoscan, Inc., 2149 E. Pratt Blvd., Elk Grove Village IL USA 60007
Phone: 847 437-6400 Fax: 847 437-1550
E-mail: info@sonoscan.com Website: www.sonoscan.com

About Sonoscan: Sonoscan is the leading developer and manufacturer of acoustic microscopy systems, widely used for non-destructive imaging and analysis of internal features. For over 30 years, Sonoscan’s attention to customer needs and investment in R&D has created systems that set industry standards for speed and accuracy. Key products include C-SAM® systems for off-line and laboratory analysis, and FACTS2™ for automated production inspection. Sonoscan application engineers, with a total of more than two centuries’ experience in acoustic microscopy, conduct frequent workshops and seminars. SonoLab, a division of Sonoscan, operates application testing laboratories in 7 global locations.


© NDT.net - The Web's Largest Portal of Nondestructive Testing (NDT) ISSN 1435-4934

Open Access Database, |Conference Proceedings| |Articles| |News| |Exhibition| |Forum| |Professional Network|